Table of Contents
What is stacked silicon interconnect?
Heterogeneous stacked-silicon (3D) integration is a reliable method to build very high bandwidth multi-chip devices that exceed current monolithic capabilities. The design delivers a stacked-silicon interconnect (SSI) implementation with acceptable thermal performance.
What is SSI device?
Synchronous Serial Interface (SSI) is a widely used serial interface standard for industrial applications between a master (e.g. controller) and a slave (e.g. sensor).
What is SLR Xilinx?
Super Logic Region (SLR) A Super Logic Region (SLR) is a single FPGA die slice contained in an SSI device. Active Circuitry. Each SLR contains the active circuitry common to most Xilinx FPGA devices. This circuitry.
What is 3D IC technology?
A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve …
What is Xilinx FPGA?
An FPGA is an integrated circuit (IC) that can be programmed for different algorithms after fabrication. Modern FPGAs consist of up to two million logic cells that can be configured to implement a variety of software algorithms.
How is VLSI different from SSI?
The first integrated circuits contained only a few transistors and so were called “Small-Scale Integration (SSI). They used circuits containing transistors numbering in the tens. LSI was followed by Very Large Scale Integration (VLSI) where hundreds of thousands of transistors were used and still being developed.
What is the process of designing more than 100 gates on a single chip?
Explanation: The full form of LSI is Large Scale Integration and refers to more than 100 upto 5000 gates per chip.
What is tile FPGA?
Logic Tiles are based on a single FPGA to provide the highest flexibility in terms of the number of FPGAs in the system. The signals from the FPGA are routed to the upper and lower stacking headers, so that the design in the FPGA can communicate with the design on the baseboard or on extra Logic Tiles on top of it.
What is tile in Xilinx FPGA?
Tile. At an abstract level, Xilinx devices are created by assembling a grid of tiles. Similar to sites, each tile is an instance of a type and each tile has a unique name with an _X#Y# suffix. Tiles are the building blocks used when constructing an FPGA device.
How does Xilinx stacked silicon interconnect technology work?
By combining TSV and microbump technology with its innovative ASMBL™ architecture, Xilinx is building a new class of FPGAs that delivers the capacity, performance, capabilities, and power characteristics required to address the programmable imperative. Via a passive interposer, Xilinx SSI technology combines multiple FPGA SLRs.
What does stacked silicon interconnect ( SSI ) technology do?
Stacked silicon interconnect (SSI) technology is the foundation of a new generation of FPGAs that break through the limitations of Moore’s law and deliver the capabilities to satisfy the most demanding design requirements.
What do you mean by through Silicon Stacking?
This TSV technique is sometimes also referred to as TSS (Through-Silicon Stacking or Thru-Silicon Stacking). A 3D integrated circuit (3D IC) is a single integrated circuit built by stacking silicon wafers and/or dies and interconnecting them vertically so that they behave as a single device.
Which is flatter edge wired or through silicon?
Because no interposer is required, a TSV 3D package can also be flatter than an edge-wired 3D package. This TSV technique is sometimes also referred to as TSS (Through-Silicon Stacking or Thru-Silicon Stacking).